| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a frame type semiconductor laser device capable of improving an heat dissipating efficiency while being provided with the feature of thin type, and an optical head device on which the semiconductor laser device is mounted. <P>SOLUTION: In the semiconductor laser devices 21, 22, a resin 218 is formed integrally with a metal frame 211 mounted on a semiconductor laser chip 215, so as to surround a semiconductor laser chip 215. The metal frame 211 is provided with fins 216 projected out of the resin part 218 at both sides of the same, and an exposed part 217 on the rear side of the element mounting unit 212a while heat can be dissipated from these parts. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
