发明名称 SAW DEVICE, TEMPERATURE CHARACTERISTIC ADJUSTMENT METHOD FOR OSCILLATOR CIRCUIT AND OSCILLATOR
摘要 PROBLEM TO BE SOLVED: To obtain a SAW device, a temperature characteristic adjustment method for an oscillator circuit, and an oscillator in which a temperature characteristic of the oscillator circuit can be more flattened within a use temperature range by using characteristics in a temperature zone lower than a point of inflection of a vibrator having tertiary function temperature characteristics. SOLUTION: The SAW device that has the tertiary function temperature characteristics and a point of inflection of the tertiary function temperature characteristics out of an ordinary use temperature range, a temperature characteristic adjustment method for the oscillator circuit with the SAW device integrated therein, and the oscillator are disclosed. A maximal or minimal temperature located within the ordinary temperature range is regarded as an apparent top temperature of secondary function temperature characteristics, the temperature characteristics are turned around the point of inflection that is located out of the ordinary temperature range, by adjusting a primary coefficient, so that the top temperature can be adjusted to an optimal value within the ordinary temperature range. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005137031(A) 申请公布日期 2005.05.26
申请号 JP20050036556 申请日期 2005.02.14
申请人 SEIKO EPSON CORP 发明人 KOBAYASHI SACHIHIRO;IMAI NOBUYUKI
分类号 H03B5/30;H03H9/25;(IPC1-7):H03H9/25 主分类号 H03B5/30
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