| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum tweezer with which stable absorption and maintenance are realized without the occurrence of cracks and scratches in a wafer, especially in a thin wafer with low mechanical strength. SOLUTION: The vacuum tweezer 1 is composed of a tweezer body 2 and an absorption adapter 3. The absorption adapter 3 is provided with an absorption chip 9 where a suction port 8 absorbing or removing the wafer is opened, a manifold 10 by a cylinder body mounted on the front side of the tweezer body 2, and a suction conduit 11 which is disposed between the absorption chip 9 and the manifold 10 and is formed by a flat cylindrical body integrated with the absorption chip 9. A suction channel 12 connected to the suction port 8 of the absorption chip 9 is penetrated through axial centers of the manifold 10 and the suction conduit 11. A plurality of divided absorption grooves 13 which are finely divided are formed on an absorption face of the absorption chip 9. COPYRIGHT: (C)2005,JPO&NCIPI |
