| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a mechanical stress exerted on a semiconductor element by mold clamping when molded in resin. <P>SOLUTION: A semiconductor device 11 includes a semiconductor element 12 and a pair of heat radiation boards 13, 14 to radiate heat from both faces of the semiconductor element 12, and is constituted so that almost all of the device may be molded in resin, wherein a bent portion 14b is provided at a portion where a lead 14a integrally formed with at least one radiation board 14 is buried into the resin 17. In such constitution, as the bent portion 14b is provided at the portion where the lead 14a is buried into the resin 17, the lead 14a is deformed relatively freely at the bent portion 14b by mold clamping at molding in resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
