| 摘要 |
PROBLEM TO BE SOLVED: To prevent the warping and deformation of a semiconductor wafer etc., after tapes are stuck to the wafer etc., by preventing the occurrence of tensile forces in the feeding directions of the tapes when sticking the tapes to the wafer etc. SOLUTION: The sticking device 10 selectively sticks a protective tape T1 to the circuit surface of the semiconductor wafer W and a dicing tape to the wafer W and a ring frame R at the time of mounting the wafer W on the frame R. The sticking device 10 comprises a sticking means 12 which sticks the protective tape T1 and dicing tape T2 fed by means of a tape feeding device 17, a wafer table 13 and a ring frame table 14 which can be moved relatively to the sticking means 12 in a state where the wafer W and ring frame R are placed on the tables 13 and 14, respectively, and a driving device 16 which moves the tables 13 and 14 relatively to the sticking means 12. Since the moving speeds of the tables 13 and 14 are controlled so that the speeds may become slower than the feeding speeds of the tapes T1 and T2, the tapes T1 and T2 can be stuck without pulling the tapes T1 and T2 in the feeding directions. COPYRIGHT: (C)2005,JPO&NCIPI |
