发明名称 WIRING SUBSTRATE CAPABLE OF BEING DIVIDED INTO A MULTITUDE OF PIECES
摘要 PROBLEM TO BE SOLVED: To provide a wiring substrate capable of being divided into a multitude of pieces, in which printing failure or the like on an insulating coat layer can be easily and correctly confirmed by naked eyes. SOLUTION: The wiring substrate is constituted of a plurality of laminated insulating layers. The substrate is provided with a rectangular ceramic mother substrate 1 in which a plurality of wiring substrate regions 4 are arrayed and formed longitudinally and laterally at the central part, and a dummy region 6 is formed at the outer peripheral part of the same; wiring conductors 3 formed in the wiring substrate region of the insulating layer; predetermined letter patterns 5 consisting of conductors formed in the dummy region; first insulating coat layers 7 formed so as to cover a part of the surfaces of wiring conductors 3; and a second insulating coat layer 8 formed so as to cover the letter patterns. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136175(A) 申请公布日期 2005.05.26
申请号 JP20030370453 申请日期 2003.10.30
申请人 KYOCERA CORP 发明人 IMAYA HIROAKI
分类号 H05K1/02;H01L23/13;(IPC1-7):H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利