发明名称 |
Semiconductor package heat spreaders and fabrication methods therefor |
摘要 |
A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
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申请公布号 |
US2005112796(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
US20030721916 |
申请日期 |
2003.11.24 |
申请人 |
ARARAO VIRGIL C.;SHIM IL K.;CHOW SENG G.;ALVAREZ SHEILA M.L. |
发明人 |
ARARAO VIRGIL C.;SHIM IL K.;CHOW SENG G.;ALVAREZ SHEILA M.L. |
分类号 |
H01L21/44;H01L21/48;H01L23/367;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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