| 摘要 |
A system and method for coupling a thermal dissipation device to a substrate to be cooled and to an underlying support. The system includes a frame having an aperture, an upper surface abutting at least part of the bottom periphery of the thermal dissipation device, and a lower surface abutting the underlying support. A biasing element is positioned within the aperture of the frame and fastened to the thermal dissipation device. The biasing element urges the substrate into contact with the thermal dissipation device by applying a biasing force thereto, and decouples this biasing force from the force securing the heat sink to the underlying support. |
