发明名称 COMPOSITE MATERIAL FOR SEALING
摘要 PROBLEM TO BE SOLVED: To provide a composite material for sealing which is substantially free of lead components for the sake of reduction of environmental load and is excellent in the required low-expansion characteristic, flow property and adhesion to a substrate. SOLUTION: The composite material for sealing contains a lead-free phosphate glass powder and a filler powder comprising Zr<SB>2</SB>WO<SB>4</SB>(PO<SB>4</SB>)<SB>2</SB>. As the lead-free phosphate glass powder, a tin phosphate-based glass powder containing, by mol, 30-70% SnO, 20-45% P<SB>2</SB>O<SB>5</SB>, 0-20% ZnO, 0-10% Al<SB>2</SB>O<SB>3</SB>, 0-10% SiO<SB>2</SB>and 0-25% B<SB>2</SB>O<SB>3</SB>or a silver phosphate-based glass powder containing, by mol, 15-85% Ag<SB>2</SB>O+AgI, 10-55% P<SB>2</SB>O<SB>5</SB>, 0-20% Ga<SB>2</SB>O<SB>3</SB>, 0-60% TeO<SB>2</SB>, 0-50% ZnO, 0-30% Nb<SB>2</SB>O<SB>5</SB>, 0-15% B<SB>2</SB>O<SB>3</SB>and 0-30% WO<SB>3</SB>can be used. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005132650(A) 申请公布日期 2005.05.26
申请号 JP20030368287 申请日期 2003.10.29
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 KIKUTANI TAKETAMI
分类号 C03C8/24;C03C3/066;C03C3/12;C03C4/00;(IPC1-7):C03C8/24 主分类号 C03C8/24
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