发明名称 |
Seed layer treatment |
摘要 |
Seed layer treatment to remove impurities in the seed layer that might lead to the formation of voids in interconnect circuit features. In one embodiment, the seed layer is heated in a reducing environment. In another embodiment, the seed layer is washed with a surfactant that is compatible with a surfactant used when forming the remainder of the circuit feature on the seed layer. Yet another embodiment combines both techniques.
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申请公布号 |
US2005112856(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
US20040981207 |
申请日期 |
2004.11.03 |
申请人 |
DUBIN VALERY M.;THOMAS CHRISTOPHER D.;CHIKARMANE VINAY B. |
发明人 |
DUBIN VALERY M.;THOMAS CHRISTOPHER D.;CHIKARMANE VINAY B. |
分类号 |
B32B9/00;H01L21/20;(IPC1-7):H01L21/20 |
主分类号 |
B32B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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