UNIVERSAL CHUCKING MECHANISM OF SEMICONDUCTOR WAFER AND WAFER MOUNTING PLATE

摘要

PROBLEM TO BE SOLVED: To provide a wafer mounting plate which is used for a universal chucking mechanism that is hardly contaminated owing to processing tailings or abrasive grains.

SOLUTION: The wafer mounting plate 3 is composed of a breathable porous ceramic disk 3c serving as a center member and a breathable porous ceramic annular body 3b which has the same height with the ceramic disk 3c and is provided integrally to the peripheral part of the ceramic disk 3c in concentricity with it through the intermediary of a non-breathable thin film annular partitioning wall 3a. An annular close contact layer 9a is formed by melting a resin adhesive agent that contains an inorganic filler, and is provided to the bottoms of the breathable members 3b and 3c of the wafer mounting plate 3 composed of the non-breathable thin film annular partitioning wall 3a and the breathable members 3c and 3b that are brought into contact with each other through the intermediary of the non-breathable thin film annular partitioning wall 3a, surrounding the non-breathable thin film annular partitioning wall 3a. Even when cleaning pressure water is supplied to the bottom of the breathable porous ceramic disk 3c, the pressure water is blocked by the non-breathable thin film annular partitioning wall 3a and the close contact layer 9a so as not to ooze out to the breathable porous ceramic annular body 3b.

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