发明名称 |
Hafnium oxide and aluminium oxide alloyed dielectric layer and method for fabricating the same |
摘要 |
The present invention relates to a dielectric layer alloyed with hafnium oxide and aluminum oxide and a method for fabricating the same. At this time, the dielectric layer is deposited by an atomic layer deposition technique. The method for fabricating the hafnium oxide and aluminum oxide alloyed dielectric layer includes the steps of: depositing a single atomic layer of hafnium oxide by repeatedly performing a first cycle of an atomic layer deposition technique; depositing a single atomic layer of aluminum oxide by repeatedly performing a second cycle of the atomic layer deposition technique; and depositing a dielectric layer alloyed with the single atomic layer of hafnium oxide and the single atomic layer of aluminum oxide by repeatedly performing a third cycle including the admixed first and second cycles.
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申请公布号 |
US2005110069(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
US20040819202 |
申请日期 |
2004.04.07 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
KIL DEOK-SIN;ROH JAE-SUNG;SOHN HYUN-CHUL |
分类号 |
H01L27/105;C23C16/40;C23C16/455;H01L21/285;H01L21/314;H01L21/316;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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