| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which enables to simply and surely melt a solder bump to perform the interlayer electrical bonding of a circuit board, to provide an adhesive layer-having substrate, and to provide a multi-layered printed circuit board. SOLUTION: This resin composition comprises a compound having a carboxy group and a phenolic hydroxy group, an epoxy resin, a novolak phenolic resin as a curing agent, and a phenoxy resin having an average mol.wt. of 5,000 to 15,000. The compound having a carboxy group and a phenolic hydroxy group is preferably a polyhydric phenol, and is more preferably contained in an amount of 5 to 25 wt.% based on the resin solid content. COPYRIGHT: (C)2005,JPO&NCIPI |
