Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method

摘要

An apparatus 10 A for manufacturing semiconductor devices includes a plurality of receiving portions 12 for receiving an upper semiconductor package 30 on a top surface of the receiving portion 12 . The receiving portion has a function of restricting the movement of the upper semiconductor package 30 in a direction parallel to a top surface of the upper semiconductor package 30 . The receiving portion 12 is a concave portion in which the upper semiconductor package 30 is adapted to be received. An adhesive material having a function of immovably holding the upper semiconductor package 30 to the receiving portion 12 may be provided within the receiving portion 12 , for example.