| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor module that is high in reliability, can be reduced in size, and can be improved in cooling efficiency. <P>SOLUTION: The power semiconductor module, provided with a cooling jacket for heat radiation, comprises an insulating substrate having first and second surfaces facing each other, a power device mounted on the first surface of the substrate, and an elastic seal brought into contact with the substrate along the outer edge of the second surface. The module also comprises the cooling jacket, brought into contact with the elastic seal, in a state where the jacket is faced to the second surface of the substrate and a pressurizing member which pressurizes the substrate toward the cooling jacket. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
