Substrate for making solder connection to second substrate or chip has solder pad with solderable adhesive surfaces in addition to electrical contact surface

摘要

The substrate (1) has a solder pad (3) on the substrate surface with an upper side (7), an underside (16) opposite the upper side on which the solder pad is joined to the substrate and bounding surfaces between the upper side and the underside, whereby the upper side forms an electrical contact surface (8) that can be soldered using a solder ball of the second substrate or the chip. The solder pad has solderable adhesive surfaces (6) in addition to the electrical contact surface.