| 摘要 |
PROBLEM TO BE SOLVED: To uniformly treat the surface of a substrate and to save space by moving one supply nozzle selected from plural nozzles positioned in a stand-by region on the substrate, supplying a treating liquid on the substrate and standing-by the other nozzles in the stand-by region. SOLUTION: Plural supply nozzles, for example, 2 nozzles 52, 62 are provided in accordance with the kinds of the treating liquids, for example, developers, applied on a wafer W used in each lot. That is, one supply nozzle 52 moves from one end side to another side of the wafer W and applies the developer to the wafer W. At this time, another supply nozzle 62 is on stand-by in the stand-by region outside the wafer W. After the supply nozzle 52 is returned to the stand-by region 7, the position of the supply nozzles 52 and the supply nozzle 62 are switched by the cooperation of a moving structure and an elevating structure. Thus, liquid sagging is not generated on the wafer W so that the wafer W is treated uniformly. |
