发明名称 |
Flip chip device having supportable bar and mounting structure thereof |
摘要 |
A flip chip device may have a semiconductor chip with an active surface on which chip pads and a protective layer may be provided. Solder bumps may be provided on the active surface and electrically connected to the chip pads. And a solder bar may be provided on a portion of the protective layer. The solder bar may disperse thermal stress produced in the solder bumps. A metal core may be embedded within the solder bar. The flip chip device may be mounted on and flip-chip bonded to a substrate. The substrate may have land pads to which the solder bumps and the solder bar may be mechanically joined. The solder bar increases a joint area between the flip chip device and the substrate and reinforces solder connections therebetween.
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申请公布号 |
US2005104222(A1) |
申请公布日期 |
2005.05.19 |
申请号 |
US20040944613 |
申请日期 |
2004.09.20 |
申请人 |
JEONG SE-YOUNG;KIM GU-SUNG;KIM NAM-SEOG;PARK GI-HWAN;OH SE-YONG;KIM SOON-BUM;LEE IN-YOUNG |
发明人 |
JEONG SE-YOUNG;KIM GU-SUNG;KIM NAM-SEOG;PARK GI-HWAN;OH SE-YONG;KIM SOON-BUM;LEE IN-YOUNG |
分类号 |
H01L23/28;H01L21/60;H01L23/16;H01L23/31;H01L23/485;H01L23/498;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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