Land grid array socket having improved load plate

摘要

A land grid array socket is provided which includes an insulative housing ( 2 ) forming a space to receive an IC chip therein and a reinforce plate ( 3 ) surrounding periphery of the housing. A load plate ( 5 ) is pivotally connected to the reinforce plate which comprises a pressing portion ( 53 ) applying a downwardly pressing force on the IC chip when the socket is at a closed state, and the pressing portion forms a contacting surface integrally pressing down to the IC chip so as to provide sufficient pressing force to the IC chip.