METHOD FOR FORMING SOLDER BUMP STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a solder bump structure capable of simplifying a solder bump structure process by using a double-exposure method of a positive photoresist.

SOLUTION: The method for forming a solder bump structure includes a step for developing a photoresist by primary exposure and forming at least one or more first openings, a step for forming a metal layer at the first opening, a step for developing a photoresist by secondary exposure and forming at least one or more second openings, and a step for forming a solder layer at the second opening.

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