发明名称 |
Semiconductor component used in power technology comprises a semiconductor body having a semiconductor base surface, a pressing composition for sealing the body and a claw structure |
摘要 |
Semiconductor component comprises a semiconductor body (2) having a semiconductor base surface (1), a pressing composition (3) for sealing the body and a claw structure for mechanically holding the pressing composition with the base surface. An independent claim is also included for a process for the production of a semiconductor component. |
申请公布号 |
DE10345247(A1) |
申请公布日期 |
2005.05.19 |
申请号 |
DE2003145247 |
申请日期 |
2003.09.29 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
STECHER, MATTHIAS;HOFMANN, RENATE;BUSCH, JOERG |
分类号 |
H01L23/31;H01L23/482;H01L23/528 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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