| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent disconnection of a wiring pattern. <P>SOLUTION: A semiconductor device includes an interposer 20 having a first and a second faces 22, 24 facing an opposite side each other and having the wiring pattern 26 formed on the first face 22, and a semiconductor chip 10 having an electrode 12 which is mounted on the first face 22 of the interposer 20 and is electrically connected with the wiring pattern 26. The interposer 20 includes a spacer 34 formed in an overlapped region with the semiconductor chip 10 of the second face 24, and a land 32 formed outside the overlapped region with the semiconductor chip 10 of the second face 24. The spacer 34 is formed so that it may not electrically connect with the wiring pattern 26. The land 32 is electrically connected with the wiring pattern 26. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
