| 摘要 |
A heat treatment apparatus ( 100 ) having: a susceptor ( 2 ) rotatably provided in a heat treatment vessel ( 1 ), on which a wafer (W) is placed; a preheat ring ( 3 ) surrounding a periphery of the susceptor ( 2 ) to be close to and in non-contact with the susceptor, which is supported by a base ( 4 ) provided in the heat treatment vessel ( 1 ); and a heating apparatus ( 8 ) for heating a wafer (W) placed on the susceptor ( 2 ), wherein the preheat ring ( 3 ) is formed such that an inner peripheral center ( 31 a) is eccentric to an outer periphery ( 32 ). The preheat ring ( 3 ) is moved around the susceptor ( 2 ); the preheat ring ( 3 ) is positioned to minimize a distance between the inner peripheral center ( 31 a) of the preheat ring ( 3 ) and the center ( 2 b) of the susceptor ( 2 ); and thereafter a heat treatment is performed to a wafer (W).
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