SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To correspond to even a case when a semiconductor chip is thinned by controlling the flow direction (a flow pressure) of an underfill material on the rear of the semiconductor chip.

SOLUTION: The sheet 18 of a thin-film keeping a single plane is bonded on the top face of the semiconductor chip 11. An adhesive such as an acrylic group is bonded on one surface of a base using a polyester group or the like as a main material on the surface of the sheet 18, and the sheet 18 is attached firmly on the top face of the semiconductor chip 11 by the adhesive. The pasty underfill material 16 composed of an epoxy resin is injected from an opening between the sheet 18 and a carrier 13 under the state. The fillet-shaped underfill material 16 is formed between the chip 11 and the carrier 13 and on the side face of the chip 11.

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