| 摘要 |
<p>A structure of the present invention has a printed circuit board (14) having a land portion (13) provided on a surface thereof on which a solder paste (12) is printed in such a condition that, with respect to a lengthwise direction of a connecting terminal (11a) of an electronic component (11) to be connected to the land portion (13), the solder paste (12) projects outward from an edge of the land portion (13) on the side of a front end of the connecting terminal (11a) and/or the solder paste (12) is withdrawn toward inside the edge of the land portion (13) on the side of a rear end of the connecting terminal (11a). Solder (12) projecting from the edge of the land portion (13) on the side of the front end of the connecting terminal (11a) is used for forming a fillet by which the front end of the connecting terminal (11a) is surely covered. Also, as the solder paste (12) is withdrawn from the edge of the land portion (13) on the side of the rear end of the connecting terminal (11a), any extra solder except for the solder indispensable for forming a soldered joint is not generated. <IMAGE> <IMAGE></p> |
