发明名称 |
Method of forming substrate for fluid ejection device |
摘要 |
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes extending spaced etch stops into the substrate from the first side, etching into the substrate between the spaced etch stops, and etching into the substrate from the second side toward the first side to the spaced etch stops. Etching into the substrate between the spaced etch stops includes forming a first portion of the opening and etching into the substrate to the spaced etch stops includes forming a second portion of the opening.
|
申请公布号 |
US6893577(B2) |
申请公布日期 |
2005.05.17 |
申请号 |
US20030374033 |
申请日期 |
2003.02.25 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
CHEN CHIEN-HUA;KRAMER KENNETH MICHAEL |
分类号 |
B41J2/16;(IPC1-7):G01D15/00;G11B5/127 |
主分类号 |
B41J2/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|