发明名称 Surface mounting device with movable conveyors
摘要 The surface mounting method includes: transferring the PCB to one conveyer among multiple conveyers capable of moving from a first transfer; transferring the PCB to another conveyer; transferring the PCB to one conveyer, while electronic parts from a parts feeder are mounted onto the transferred PCB; mounting the electronic parts from the parts feeder again onto the transferred PCB, while the PCB onto which the parts have been mounted is transferred to the second transfer; and transferring the PCB onto which the parts have been mounted again to the second transfer, while a new PCB is transferred to one conveyer of the conveyers from the first transfer.
申请公布号 US6892446(B2) 申请公布日期 2005.05.17
申请号 US20010987752 申请日期 2001.11.15
申请人 MIRAE CORPORATION 发明人 HWANG JI HYUN;KIM DO HYUN
分类号 B23P19/00;H05K13/00;H05K13/02;H05K13/04;(IPC1-7):H05K3/30 主分类号 B23P19/00
代理机构 代理人
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