发明名称 VACUUM TREATMENT APPARATUS FOR RECTANGULAR OR SQUARE FLAT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a structure principle which further reduces an installation area, a chamber volume and an evacuation period, and further simplifies "handling" for substrates outside and inside of a vacuum chamber, but reduces the contamination onto the substrate particularly by exfoliating particles from a layered product; and an operation procedure therefor. SOLUTION: This vacuum treatment apparatus has a substrate holder 13, and a linkage 8 for connecting a lower region of the substrate holder with a drive mechanism 1. At least a swiveling support part in the lower part of the linkage 8 is arranged below a horizontal bisector M which divides a height H of a supporting plane of the substrate holder 13 into two. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005120468(A) 申请公布日期 2005.05.12
申请号 JP20040272073 申请日期 2004.09.17
申请人 APPLIED FILMS GMBH & CO KG 发明人 LINDENBERG RALPH;FUCHS FRANK;SCHUSSLER UWE;BANGERT STEFAN;STOLLEY TOBIAS
分类号 C23C14/56;B65G49/06;H01L21/205;H01L21/68;(IPC1-7):C23C14/56 主分类号 C23C14/56
代理机构 代理人
主权项
地址