发明名称 |
VACUUM TREATMENT APPARATUS FOR RECTANGULAR OR SQUARE FLAT SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a structure principle which further reduces an installation area, a chamber volume and an evacuation period, and further simplifies "handling" for substrates outside and inside of a vacuum chamber, but reduces the contamination onto the substrate particularly by exfoliating particles from a layered product; and an operation procedure therefor. SOLUTION: This vacuum treatment apparatus has a substrate holder 13, and a linkage 8 for connecting a lower region of the substrate holder with a drive mechanism 1. At least a swiveling support part in the lower part of the linkage 8 is arranged below a horizontal bisector M which divides a height H of a supporting plane of the substrate holder 13 into two. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005120468(A) |
申请公布日期 |
2005.05.12 |
申请号 |
JP20040272073 |
申请日期 |
2004.09.17 |
申请人 |
APPLIED FILMS GMBH & CO KG |
发明人 |
LINDENBERG RALPH;FUCHS FRANK;SCHUSSLER UWE;BANGERT STEFAN;STOLLEY TOBIAS |
分类号 |
C23C14/56;B65G49/06;H01L21/205;H01L21/68;(IPC1-7):C23C14/56 |
主分类号 |
C23C14/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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