| 摘要 |
<P>PROBLEM TO BE SOLVED: To conduct a burn-in without bringing a probe pin into contact with a solder ball in a semiconductor device with the solder ball. <P>SOLUTION: After columnar electrodes 9 and sealing films 10 are formed on a semiconductor substrate 1 in a wafer state, the probe pins 23 are brought into contact on the electrodes 10, and the burn-in is conducted. The solder balls are formed on the electrodes 10, and the semiconductor substrate 1 in the wafer state is diced. Consequently, the unnecessary deformation of the solder balls due to the contacts of the probe pins 23 can be prevented, and the burn-in can be conducted even when the heights of the solder balls are varied. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
