发明名称 METHOD FOR ELECTROLESS-PLATING ARTICLE TO BE PLATED HAVING POLYIMIDE RESIN
摘要 PROBLEM TO BE SOLVED: To provide a method for electroless-plating an article to be plated having a polyimide resin, which is superior in safety during a plating operation, does not cause the blister and peeling of the plating film from the polyimide resin at all, and rapidly and uniformly grows a plating film having adequate adhesiveness. SOLUTION: The method for electroless-plating the article to be plated having the polyimide resin comprises a pretreatment step of immersing the article to be plated in an aqueous solution containing one or more alkali metal compounds and one or more primary amino alcohols; a degreasing and cleaning step; a catalyst-imparting step; and a catalyst-activating step. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005120407(A) 申请公布日期 2005.05.12
申请号 JP20030354973 申请日期 2003.10.15
申请人 HITACHI CHEM CO LTD 发明人 NODO TAKAAKI;YOKOSHIMA HIROYUKI;KURAMOCHI KAZUICHI;YAMAMOTO HIROSHI;AKAZAWA SATOSHI;MURAKAMI KANJI
分类号 C23C18/20;(IPC1-7):C23C18/20 主分类号 C23C18/20
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