| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition comprising (A) a polyimide resin having a phenolic hydroxy group in a polymer skeleton and an organopolysiloxane bond having a phenyl group as an organic substituent in the main chain, (B) an epoxy compound, and (C) an epoxy resin-curing catalyst as essential components; and to provide an adhesive film obtained by using the adhesive composition. <P>SOLUTION: The adhesive film obtained from the adhesive composition provides high adhesive strength to various kinds of materials by thermocompression bonding or heat curing, also provides high adhesive strength to a sealing resin, has low modulus and high heat resistance, and enables a resin-packaged semiconductor device with high reliability to be produced. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
