| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible printed circuit board (FPC) by hot pressing, which can remove a problem that a separating film made of a polymer material adheres to a copper wiring circuit of a copper-clad laminate (CCL) exposed from the opening of a cover lay film (CL) with an adhesive upon the manufacture of the film to avoid improper plating to the copper wiring circuit, and which also can eliminate a gap between the copper wiring circuit and the adhesive of the CL; and also to provide a separating film made of a polymer material subjected to electronic beam irradiation crosslinking, which can avoid adhesion to the copper wiring circuit of the CCL even when the manufacturing method is employed. SOLUTION: The separating film made of the polymer material used upon manufacture of a flexible printed circuit board by hot pressing is formed into a separating film subjected to electronic beam irradiation crosslinking. COPYRIGHT: (C)2005,JPO&NCIPI
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