| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip-type light emitting device which reduces the number of processes for cost reduction and achieves high brightness and compactify the device, and provide a method for manufacturing the device. <P>SOLUTION: A pair of electrode pads 13 made up of metal films lies on the top of a laminated aluminum substrate 10, and a p electrode 25 and an n electrode 26 on the LED light emitting layer 28 of the LED chip 20. In addition, an insulated protection film 27 lies on the LED chip 20 in a way that a part of the p electrode 25 and the n electrode 26 are exposed. The p electrode 25 and n electrode 26 exposed from the insulated protection film 27 are connected to a pair of electrode pads 13 on the laminated aluminum substrate 10 through the Au bump 30 and silver paste 31, respectively, so that the LED chip 20 is pasted onto the laminated aluminum substrate 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
