发明名称 |
ELECTROLYTIC PROCESSING APPARATUS AND ELECTROLYTIC PROCESSING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To detect the endpoint of electrolytic processing stably with high precision and with a relatively simple construction. SOLUTION: The electrolytic processing apparatus comprises: a holding section 42 for holding a processing object; a processing electrode 50 which can come close to or into contact with the processing object; a feeding electrode 52 for feeding electricity to the processing object; a fluid supply section 72 for supplying fluid between the processing object and at least one of the processing electrode and the feeding electrode; a processing power source 78 for applying a voltage between the processing electrode and the feeding electrode; a drive section for causing relative movement between the processing object and at at least one of the processing electrode and the feeding electrode; and an eddy current sensor 110 for detecting the thickness of the processing object from a change in eddy current loss, said sensor being disposed not in contact with or separately by an insulator from the processing electrode and/or the feeding electrode. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005120464(A) |
申请公布日期 |
2005.05.12 |
申请号 |
JP20040248128 |
申请日期 |
2004.08.27 |
申请人 |
EBARA CORP |
发明人 |
NOMICHI IKUTARO;YASUDA HOZUMI;IIIZUMI TAKESHI;HIROKAWA KAZUTO;OBATA ITSUKI |
分类号 |
C25F3/00;C25F3/12;C25F7/00;(IPC1-7):C25F3/00 |
主分类号 |
C25F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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