| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of a visually different area in a surface state by a whisker-like body; and to remove the whisker-like body without substantially having influence on polishing work time of a notch of a semiconductor wafer, in a mirror polishing device of a wafer notch. SOLUTION: Whisker removing tools 7 and 7' capable of removing the whisker-like body M generated in a polishing tool 211, are arranged on the opposite side of a wafer support surface of a tiltable wafer chuck table 6. Whiskers are removed by pressing the polishing tool 211 to the whisker removing tools 7 and 7' by predetermined force by tilting the wafer chuck table 6 at a whisker removing angleβoutside of a range of a tile angle for polishing the notch. COPYRIGHT: (C)2005,JPO&NCIPI
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