WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To improve long-term reliability in a COF-type semiconductor device equipped with a semiconductor chip mounted on a wiring board using ACF by protecting a short circuit (failure) caused by the growth of whiskers against the semiconductor device. SOLUTION: The wiring board is composed of an insulating board and a conductor pattern formed on its surface, and the semiconductor chip is mounted on the wiring board using ACF. An alloy film formed of tin and a material forming the conductor pattern, a gold plating film, or an anti-oxidizing film is formed on the surface of the conductor pattern. COPYRIGHT: (C)2005,JPO&NCIPI