发明名称 ETCHING METHOD, VIBRATOR, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide an etching method by which a structure in a desired shape can be precisely formed and etching friendly to the environment can be realized during etching, for example, by reducing an amount of substances scattering from a substrate, a vibrator manufactured by using the etching method, and electronic equipment provided with such a vibrator. SOLUTION: The etching method is employed for working a first layer 103 into a prescribed shape by etching. The etching method has a process for forming a mask 11 provided with a mask 111 for patterning in a shape corresponding to the prescribed shape and a mask 112 for a dummy, which is separated from the mask 111 and arranged so as to make the width of a gap 110 at each part in an etching region almost equal, in an etching region of the first layer 102, a process for patterning the first layer 103 on the side opposite to a second layer 103 with first etching by using the mask 11, and a process for removing a dummy part 9 subjected to the patterning corresponding to the mask 112 for a dummy of the first layer 103. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005118939(A) 申请公布日期 2005.05.12
申请号 JP20030356980 申请日期 2003.10.16
申请人 SEIKO EPSON CORP 发明人 NAKAJIMA TAKUYA
分类号 B81C1/00;B81B3/00;H03H9/24;(IPC1-7):B81C1/00 主分类号 B81C1/00
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