| 摘要 |
In a barrier formation process, an adhesion layer of refractory metal is deposited on sidewalls and bottom portions of a trench, and, subsequently, a nitride layer of the refractory metal is formed on the adhesion layer. After forming the nitride layer, the substrate is subjected to a heat treatment in a nitrogen-containing atmosphere to further convert residual refractory metal into nitride, thereby improving the barrier properties of the nitride layer in a subsequent process for filling in a contact metal, such as tungsten.
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