| 摘要 |
A lead frame for a high power semiconductor device die has three external lead conductors, the outer two of which are reentrantly bent outwardly from the center of the lead frame. When the lead frame is overmolded, the outer conductors are spaced from a central conductor by an increased creepage distance along the plastic surface of the housing. Further, the lead sequence of the exterior leads is gate, source, drain for a power MOSFET. The post area for wire bonding to the source post is enlarged to permit wire bonding with at least three bond wires. The external conductors can be downwardly bent to form a surface mount device. The cross-sectional area of the external conductors is substantially enlarged, although only a small enlargement of the circuit board hole is needed. The package outline has a long flat area centered over the main die area, with a tapered end surface which allows the package to pry open a mounting spring for surface mounting of the package. |
