Microelectronic package within cylindrical housing,申请号GB20040011736-传众专利搜索

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发明名称	Microelectronic package within cylindrical housing
摘要
申请公布号	GB2404282(B)	申请公布日期	2005.05.11
申请号	GB20040011736	申请日期	2004.05.26
申请人	* VISTEON GLOBAL TECHNOLOGIES, INC.;* VISTEON GLOBAL TECHNOLOGIES, INC.	发明人	ANDREW ZACHARY * GLOVATSKY;VLADIMIR * STOICA
分类号	H05K7/14;H05K7/20;(IPC1-7):H05K7/14	主分类号	H05K7/14
代理机构		代理人
主权项
地址

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