发明名称 |
Packaging system for die-up connection of a die-down oriented integrated circuit |
摘要 |
A die attach package for connecting a die or chip of die-down orientation to a printed circuit board in a die-up orientation. The package includes a substrate with leads that may be traces terminating in vias or that may be the leads of a lead frame. The traces or the leads of the lead frame are modified such that they pass under the die when the die is attached. The traces or leads are routed under the die such that proper connections are established from the topside of the die to the appropriate mount locations of the printed circuit board. The die is attached to the substrate using a non-electrically-conductive material. This packaging enables a fabricator to make die of one orientation type, die down, and use that die in a die-up package, thereby saving on fabrication costs.
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申请公布号 |
US6891257(B2) |
申请公布日期 |
2005.05.10 |
申请号 |
US20010823600 |
申请日期 |
2001.03.30 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
CHONG DAVID;LEE HUN KWANG;ALLEN HOWARD;MARTIN STEPHEN |
分类号 |
H01L21/60;H01L23/495;H01L23/498;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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