| 摘要 |
A lead tester assembly 10 is provided, for use with a circuit board 12 populated with a plurality of electronic components 18 each including at least one lead 20 protruding through the circuit board 16 . A conductive plate element 32 is positioned below the circuit board 16 and is movable between a test active position 24 and a test inactive position 26 . At least one sleeve element 38 is mounted to and is in electrical communication with the conductive plate element 32 . A movable sensor 36 is in electrical communication with the at least one sleeve element 38 when the conductive plate element 32 is in said test inactive position 26 . A non-conductive probe 46 , slidably positioned within the sleeve element 38 , is movable between a lead absent position 50 and a lead present position 52 upon engaging one of the leads 20 . The non-conductive probe 46 forces the movable sensor 36 out of electrical communication with the sleeve element 38 when in the lead present position 52.
|
