BGA package with component protection on bottom

摘要

A ball grid array (BGA) package includes an electronic component mounted on its bottom. Formed on the lower surface of the substrate are the electronic component, a plurality of standoffs and a plurality of solder balls. The standoffs, such as metal balls, are adjacent to the electronic component within the solder balls. The standoffs have a melting point higher than that of the solder balls and offer a uniform standoff height larger than the thickness of the electronic component to control the package collapse to protect the electronic component from contacting a PCB during reflowing process.