发明名称 |
Prepreg and process for manufacturing same |
摘要 |
<p>A prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The prepreg comprises an inner layer made from a glass fiber substrate, having a weight of 40 g or more and less than 115 g per square meter and an air permeability or 20 cm<3>/cm<2>/sec or less, impregnated with an epoxy resin, and an outer layer of an epoxy resin coating provided on at least one side of the inner layer, wherein the epoxy resin reaction rate in the inner layer is 85% or more and the epoxy resin reaction rate in the outer layer is 60% or less. <IMAGE></p> |
申请公布号 |
EP1241207(B1) |
申请公布日期 |
2005.05.04 |
申请号 |
EP20010127802 |
申请日期 |
2001.11.22 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
YAMAJI, TAKASHI;KOMATSU, MAMORO |
分类号 |
B29C70/06;B29B15/12;C08J3/24;C08J5/24;H05K1/03;H05K3/46;(IPC1-7):C08J5/24;C08L63/00 |
主分类号 |
B29C70/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|