| 摘要 |
A composition comprises a polymeric resin, a conductive filler, a corrosion inhibitor selected from N-hydroxysuccinimide and/or piperidine, a curing agent or catalyst, an adhesion promoter, and 8-hydroxyquinoline. The resin may be a vinyl, acrylic, phenolic, epoxy, maleimide, polyimide, or silicon-containing resin but bisphenol A and bisphenol F epoxy resins are preferred. The conductive filler is typically silver. Meanwhile, the adhesion promoter may be a silane or polyvinyl butyrol and the curing agent/catalyst may be liquid imidazole or a solid tertiary amine. The composition may further contain a reactive or non-reactive diluent. The composition may be suitable for use as a conductive adhesive in microelectronic devices or semiconductor packages to provide electrically stable interconnections. |
