发明名称 |
Method of polishing and cleaning substrates |
摘要 |
The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage station located in a chamber of the module to hold a plurality of substrates in a substantially horizontal position. The storage station may hold pad break-in wafers for pad preconditioning and/or monitor wafers for defects monitoring. The particle monitor may have a port coupled to the factory interface module.
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申请公布号 |
US6887124(B2) |
申请公布日期 |
2005.05.03 |
申请号 |
US20020153464 |
申请日期 |
2002.05.21 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
PINSON, II JAY D.;SHANMUGASUNDRAM ARULKUMAR |
分类号 |
H01L21/00;H01L21/677;(IPC1-7):B24B1/00;B24B49/00;B24B51/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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