| 发明名称 |
HEAT RESISTANT RESIN COMPOSITION AND ADHESIVE SHEET USING THE SAME |
| 摘要 |
<p>A HEAT RESISTANT RESIN COMPOSITION COMPRISING (A) A POLYAMIDE-IMIDE RESIN AND (B) A THERMOSETTING RESIN COMPONENT, SAID COMPOSITION GIVING A CURED PRODUCT HAVING A STORAGE ELASTIC MODULUS AT 300°C OF 30 MPA OR MORE, PROVIDES AN ADHESIVE SHEET SHOWING EXCELLENT SOLDER HEAT RESISTANCE.</p> |
| 申请公布号 |
MY119145(A) |
申请公布日期 |
2005.04.30 |
| 申请号 |
MY1997PI03763 |
申请日期 |
1997.08.15 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
EIICHI SHINADA;YOSHIYUKI TSURU;TAKESHI HORIUCHI |
| 分类号 |
C08L63/00;C08L79/08;H05K1/00;H05K1/03;H05K3/38;H05K3/46 |
主分类号 |
C08L63/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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