HEAD MODULE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, MANUFACTURING METHOD OF HEAD MODULE AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD,申请号KR20040084633-传众专利搜索

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发明名称	HEAD MODULE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, MANUFACTURING METHOD OF HEAD MODULE AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD
摘要
申请公布号	KR20050039623(A)	申请公布日期	2005.04.29
申请号	KR20040084633	申请日期	2004.10.22
申请人	SONY CORPORATION	发明人	ANDO, MAKOTO;ANDO, NAOSHI;HORII, SHINICHI;KAYABA, SHINJI;MURAKAMI, TAKAAKI;TAKAKURA, MASAYUKI;TANIKAWA, TORU;TOMITA, MANABU
分类号	B41J2/05;B41J2/14;B41J2/155;B41J2/16;(IPC1-7):B41J2/05	主分类号	B41J2/05
代理机构		代理人
主权项
地址

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