| 摘要 |
There are provided a semiconductor device mounting board, a method of manufacturing the same, a method of inspecting the same, and a semiconductor package in which by improving a conventional wiring board, the semiconductor device mounting board is capable of implementing a high-density and fine structure corresponding to a narrowing pitch and has high mounting reliability. A semiconductor device mounting board characterized by comprising a wiring construction film including an insulating layer and a wiring layer, a first electrode pattern disposed on one surface of the wiring construction film in which a periphery of a side surface of the electrode pattern is in contact with the insulating layer, at least a rear surface of the first electrode pattern is not in contact with the insulating layer, and the insulating layer surface on which the first electrode pattern is disposed is in a plane in which the first electrode pattern rear surface exists; a second electrode pattern in a surface on an opposing side of the first electrode pattern, an insulator film in which an opening pattern which can be housed in the first electrode pattern is disposed, and a metallic supporter disposed on the insulator film surface. |
