| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the semiconductor laser of a molded type equipped with a lead frame whose adhesion to resin is improved, is accurately positioned when it is mounted on a housing or the like, and is capable of dissipating heat sufficiently. <P>SOLUTION: This semiconductor laser is configured in a manner where a die pad 15 and leads 11 to 14 formed of a plate-like lead frame 1 are integrally held by a molding resin member 2, and where a laser chip 4 is mounted on the die pad 15 through the intermediary of a sub-mount 3. The die pad 15 and the tips of the leads 11 to 14 are not subjected to forming processing, so that the molding resin member 2 is provided on both the front and rear of a part of the lead frame 1, most of the rear of the die pad 15 is not covered with the molding resin member 2 and is kept exposed, and a positioning and/or heat-dissipating fin 16 whose front and rear surface are not covered with the resin molding member 2 and kept exposed is formed on the side of the die pad 15. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
